QUICK Re-Balling Reflow Oven, 1600W IR dark radiator, sensor-controlled for freely selectable temperature profiles

Equipped with infrared dark radiators, a closed temperature control circuit that ensures a precise and stable temperature with low fluctuations.

Infrared ceramic heating plate bottom 400W
Infrared quartz radiator top side 1200W

Holistic heating reduces temperature differences between components to a minimum. Ideal for BGA reballing processes.

The device is equipped with an observation window through which the melting of the solder ball of the BGA chip can be observed in real time.

Temperature range: 50°C – 300°C
Temperature profiles can be stored: 10
Usable heating surface: 130 x 130 mm
Housing dimensions: 355 x 225 x 180 mm