Interflux DP 5505 – lead-free, no-clean solder paste recommended for SMD stencil printing
Interflux DP 5505 is a lead-free solder paste for professional SMD soldering work and electronic assemblies. The SAC305 alloy used consists of Sn96.5Ag3.0Cu0.5 and has a melting range of approximately 217 to 220 °C. The product, described in the safety data sheet as halogen-free and lead-free, is intended for industrial soldering applications.
With a metal content of 88.5 per cent, this formulation is particularly suitable for application using the stencil printing process. The fine grain size (Type 4) ensures even paste distribution, even on smaller SMD pads and with tighter component spacing. This makes the solder paste suitable, amongst other things, for the manufacture, repair and assembly of modern electronic assemblies.
The integrated ROL0 no-clean flux aids wetting of the solder surfaces and leaves only minimal flux residues after a tailored reflow process. In many standard electronic applications, subsequent cleaning is therefore not required. Whether residues still need to be removed depends on the requirements of the respective assembly, the subsequent coating and the operational process specifications.
It is supplied in a 250 g tin. This pack size is well suited to electronics workshops, laboratories, development departments, repair shops and small to medium-sized production runs.
Recommended Applications
The DP 5505 is primarily recommended for SMD stencil printing. In this process, the solder paste is applied to the solder pads on the printed circuit board using a squeegee through the apertures of a suitable stainless steel stencil. The SMD components are then placed on the board and the assembly is soldered in a suitable reflow oven.
Typical areas of application include:
SMD assembly of electronic printed circuit boards
Stencil printing for prototypes and series production
Processing of smaller pad and terminal geometries
Repair and re-assembly of assemblies
Electronics development, laboratories, workshops and training
Lead-free soldering processes using SAC305 alloy
The specific reflow profile should always be adapted to the printed circuit board, components, assembly size, stencil thickness and oven technology used. As the enclosed document is a safety data sheet and not a technical process data sheet, the heating rate, activation phase, peak temperature and cooling should be determined on the basis of the manufacturer’s technical specifications or through your own soldering trials.
Handling and storage
The solder paste should be stored in a cool place at 3 to 10 °C. Before opening, allow the unopened tin to come slowly to room temperature. This prevents moisture or condensation from forming in the paste. The safety data sheet specifies a maximum storage period of nine months for printable formulations with a metal content of 88 to 89 per cent; the information printed on the packaging remains authoritative
Before use, the paste should be gently homogenised without incorporating unnecessary air. Paste that has been removed should not be mixed with fresh material in the original container. After use, the container should be carefully resealed and stored in a cool place in accordance with the manufacturer’s instructions.
Technical data
Manufacturer: Interflux
Product name: DP 5505
Alloy: Sn96.5Ag3.0Cu0.5 / SAC305
Type: lead-free and halogen-free
Flux classification: ROL0
Flux type: No-Clean
Grain size: Type 4
Metal content: 88.5 %
Melting range: approx. 217 to 220 °C
Contents: 250 g
Packaging: tin
Recommended storage: 3 to 10 °C
Safety information: The solder paste contains rosin and may cause allergic skin reactions. Suitable protective gloves and safety goggles should be worn during use. Ensure adequate local extraction or ventilation is provided during soldering.
