Remove solder quickly and cleanly with the GALLUNOPTIMAL ELP-MAX hand desoldering pump. The high suction volume of approx. 34 cm³ generates strong vacuum power to clear solder from joints efficiently, including larger solder points and through-hole (THT) connections on circuit boards. It supports controlled component removal and helps free pads and plated through-holes during repair, rework, training, and hobby electronics.

For precise work, the pump features a heat-resistant, ESD-suitable Teflon tip with a 3.5 mm inner opening. The tip can be replaced when needed and allows accurate positioning on pins, pads, and solder joints. A robust spring mechanism ensures consistent triggering, while lubricated contact points contribute to smooth operation over repeated use.

Maintenance is straightforward: the bayonet lock enables fast opening for cleaning and quick removal of residues. The design also provides a self-cleaning effect during each tensioning cycle, supporting reliable performance in daily use. For transport and storage, the pump is retractable and fits easily into compact tool bags.

Technical Highlights
– Suction volume: approx. 34 cm³
– Tip type: ESD Teflon tip, replaceable, heat-resistant
– Tip inner opening: 3.5 mm
– Length: 335 mm, retractable to 240 mm
– Pump diameter: 27 mm
– Weight: approx. 95 g
– Housing: heat-resistant plastic, black/chrome look