low-melting with bismuth

Interflux LMPA-Q Hand Soldering Kit SnBi with low-melting solder wire 1.0 mm, 30 wires approx. 20 cm incl. flux

Katalog-Nr.: IFLMPAQS-10BI EAN-Nummer: 4250078323600 Verfügbarkeit: ab Lager lieferbar
1 Stk.34,32 

inkl. MwSt.

zzgl. Versandkosten

Interflux LMPA-Q Hand Soldering Kit with low-melting solder wire SnBi 1.0 mm, 30 wires approx. 20 cm incl. flux Select IF

The LMPA™-Q hand soldering kit can be used for applications where slow soldering or poor penetration with an Sn(Ag)Cu alloy is a problem.
The hand soldering process with the kit is faster and penetration is much easier.

Typical applications where the kit is used for low-melting-point hand soldering
are thermally heavy components and printed circuit boards with a lot of Cu mass. For extremely thermally heavy applications, the use of a gel-like flux such as IF 8300-6 can be advantageous. To make the most of this advantage,
it is recommended to use the same soldering tip temperature as for Sn(Ag)Cu alloys (320-390°C). If necessary, however, the soldering tip temperature can be reduced to 280°C. This could be the case when soldering temperature-sensitive components.

The LMPA™-Q hand soldering kit contains:
– A tube with 30 lengths (20 cm +/- 0.5 cm) of LMPA™-Q wire (SnBi) without flux core, 1 mm in diameter
– A 100 ml bottle of SelectIF 2040 flux

+++++++++++++++++++++++
Do not use for soldering Pb-containing surfaces or solder joints.
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Ausführung mit Flussmittel

Ja

Drahtdurchmesser

1.00 mm

Flussmittelstärke

schwach

Flussmitteltyp

ORL0

Gewicht 0,18 kg
Größe 65 × 65 × 210 mm
Hersteller

Interflux

Legierung

LMPA-Q SnBi

bleifrei

Ja

no clean

Ja

EU-Produktverantwortlicher

Interflux Electronics nv
https://interflux.com/
Eddastraat 51
BE 9042 Gent
1 Stk.34,32 

inkl. MwSt.

zzgl. Versandkosten

Interflux LMPA-Q Hand Soldering Kit SnBi with low-melting solder wire 1.0 mm, 30 wires approx. 20 cm incl. flux

1 Stk.34,32 

inkl. MwSt.

zzgl. Versandkosten